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1 of 12 optimum technology matching? applied gaas hbt ingap hbt gaas mesfet sige bicmos si bicmos sige hbt gaas phemt si cmos si bjt gan hemt functional block diagram rf micro devices?, rfmd?, optimum technology matching?, enabling wireless connectivity?, powerstar?, polaris? total radio? and ultimateblue? are trademarks of rfmd, llc. bluetooth is a trade- mark owned by bluetooth sig, inc., u.s.a. and licensed for use by rfmd. all other trade names, trademarks and registered tradem arks are the property of their respective owners. ?2006, rf micro devices, inc. product description 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . ordering information 14 13 12 11 10 9 8 7 6 5 4 3 2 1 16 15 if amp rfdec rfin gnd ifvcc ifset ifsetb ifout ifoutb gnd mixloadb mixload rfagc lo lob gnd rfvcc RF3334 if low noise amplifier/mixer the RF3334 is an if lna/mixer suitable for downconversion of forward channel control data in a set-top box applicatio n. it consists of a single-ended 75 termi- nated lna, followed by a differential gain control stage with 30db of analog gain control and a double-balanced mixer. the mixer load is available via pins 10 and 11 should an external filter be required. the mixer output is connected to an if ampli- fier that can be configured from 10db to 40db gain with an external resistor. the amplifier is capable of 6v pk-pk output into a 1k load. features ? 30db rf gain control ? 40db if gain control ? 5db max. noise figure ssb ? lna input internally matched to 75 ? single 5v supply applications ? cable set top box ? general purpose downconverter ? commercial and consumer sys- tems RF3334 lna mixer RF3334pcba-41x fully assembled evaluation board rev a6 ds061016 9 RF3334if low noise ampli- fier/mixer rohs compliant & pb-free product package style: qfn, 16-pin, 4 x 4
2 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . absolute maximum ratings parameter rating unit supply voltage -0.5 to 7.0 v dc if input level 500 mv pp operating ambient temperature -40 to +85 c storage temperature -40 to +150 c parameter specification unit condition min. typ. max. dc specifications supply voltage 4.75 5 5.25 v supply current 20 24 ma rfagc control voltage 0.5 4.5 v 0.5v=minimum gain 4.5v=maximum gain rfagc input impedance 300 k ac specifications lna+agc+mixer rf frequency range 0 to 700 mhz on-chip signal path is dc-coupled, minimum frequency depends on external ac coupling components. rf input 3db bandwidth 700 mhz on-chip signal path is dc-coupled, minimum frequency depends on external ac coupling components. rf input impedance 75 rf input vswr 1.4 at 100mhz mixer output 3db bandwidth 100 mhz defined by on-chip first-order low-pass filter mixer output impedance 300 differential mixer output vswr 1.2 at 100mhz maximum gain 27 30 db rfagc=4.5v minimum gain -2 db rfagc=0.5v output 1db compression 90 db v(rms) maximum gain input ip3, maximum gain 78 db v(rms) lna input to mixer output input ip3, minimum gain 79 db v(rms) lna input to mixer output noise figure 5 db ssb, cascaded lna, agc & mixer caution! esd sensitive device. exceeding any one or a combination of the absolute maximum rating conditions may cause permanent damage to the device. extended application of absolute maximum rating conditions to the device may reduce device reliability. specified typical perfor- mance or functional operation of the devi ce under absolute maximum rating condi- tions is not implied. rohs status based on eudirective2002/95/ec (at time of this document revision). the information in this publication is believed to be accurate and reliable. however, no responsibility is assumed by rf micro devices, inc. ("rfmd") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. no license is granted by implication or otherwise under any patent or patent rights of rfmd. rfmd reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice.
3 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . parameter specification unit condition min. typ. max. lo lo frequency range 0 to 800 mhz lo input impedance 75 differential lo input vswr 1.6:1 lo input level 80 dbuv lo bandwidth 800 mhz lo rejection to rf input 50 db lo rejection to input of if ampli- fier 65 db if amplifier if frequency range 0 to 120 mhz input impedance 4000 differential output impedance 10 differential differential voltage gain gain set resistor=2500 10 db r1=1k gain set resistor=140 31 db r1=1k gain set resistor=5 40 db r1=1k if 3db bandwidth 140 mhz gain set=5 equivalent input noise 1.5 vrms gain set = 140 output swing 6 8 v p-p into 1k load, at 50mhz output 1db compression 127 db v(rms) into 1k load, at 50mhz output ip3 137 db v(rms) into 1k load, at 50mhz thermal v cc =5.25v, vrfagc=4.5v, i cc =29ma, p diss =154mw theta jc 65 c/w maximum measured junction temperature at dc bias conditions 95 c t amb =+85c
4 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . pin function description interface schematic 1rfdec external decoupling capacitor for rf single-ended to differential converter. 2rf lna input, internally matched to 75 . should be ac-coupled. 3gnd ground. 4ifvcc 5v supply for if section. 5ifset if gain select. the resistance between this pin and pin 6 (ifsetb) deter- mines the gain of the if amplifier. maximum gain is achieved by placing a short circuit between the pins. larger values of resistance will reduce the if gain according to the following equation where r is the value of resis- tance between pins 5 and 6. ifgain=20log(1600/(r=75))15. 6ifsetb complementary if gain select. 7ifout if amplifier output. differential output of the if amplifier. the differential load across this pin and pin 8 (ifoutb) should be 1k or greater for opti- mal performance. the differential output impedance across this pin and pin 8 in 10 . 8ifoutb complementary if amplifier output. 9gnd ground. 10 mixloadb complementary mixer load. 11 mixload differential output of the rf mixer. a resonant load should be applied to this pin and pin 10 (mixloadb) that will act as a bandpass filter at the desired if frequency. v cc should be supplied to this pin via an inductor or a resistor. use of a resistor will degrade intermodulation performance. 100 rfdec v cc vbias rf ifsetb ifset ifsetb ifset if out vbias v cc if outb vbias v cc mixload mixloadb mixload mixloadb
5 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . package drawing pin function description interface schematic 12 rfagc rf gain select voltage input. the voltage applied to this pin sets the gain of the rf amplifier. the voltage applied to this pin should be between 0.5v and 4.5v. the rf gain characteristic is such that 0.5v yields a gain of -2db and 4.5v yields a gain of +30db as measured from the input of the lna to the output of the mixer stage. 13 lo differential lo input. this pin and pin 14 (lob) are the differential lo inputs. this input should be ac-coupled. the differential input impedance across pins 13 and 14 is 75 . the lo may be driven single ended but will require a higher drive level. if a single ended lo is applied, pin 14 should be ac-coupled to ground. 14 lob complementary lo input. should be ac-coupled. 15 gnd ground. 16 rfvcc 5v supply for rf section. gnd paddle backside of package should be connected to ground. 100 k rfagc 10 k vref 300 lob 300 lo vbias 75 300 lob 300 lo vbias 75 0.10 cab m 0.35 0.23 pin 1 id 0.20 r 2.25 1.95 sq. 0.65 0.75 0.50 typ 0.60 0.24 typ 0.05 c 0.90 0.85 0.70 0.65 0.05 0.00 12 max -c- seating plane shaded lead is pin 1. dimensions in mm. 0.10 c a 2 plcs -a- 4.00 sq. 0.10 c b 2 plcs 0.10 c b 2 plcs -b- 3.75 sq 1.87 typ 0.10 c a 2 plcs 2.00 typ
6 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . pin-out application schematic 14 13 12 11 10 9 8 7 6 5 4 3 2 1 16 15 rfdec rfin gnd ifvcc ifset ifsetb ifout ifoutb gnd mixloadb mixload rfagc lo lob gnd rfvcc 14 13 12 11 10 9 8 7 6 5 4 3 2 1 16 15 if amp 10 nf 10 nf 10 n r* l c r c l 10 nf 1 k rfagc 10 pf 1 nf 1 uf + rfin v cc v cc ifoutb ifout v cc 10 nf 10 nf lob lo
7 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . evaluation board schematic 14 13 12 11 10 9 8 7 6 5 4 3 2 1 16 15 if amp c2 10 nf c3 10 nf 50 strip j3 rf in c6 10 nf vcc r2 140 r3 475 r4 475 r5 100 c7 10 n c9 10 n j5 ifoutb j4 ifout l2 120 nh c8 82 pf r6 750 c5 82 pf l1 120 nh vcc c4 10 nf r1 1 k rfagc c11 10 pf c10 1 nf vcc c1 1 uf + 50 strip j2 lo t1 ttwb-1-a j1 1 2 3 con3 j1-1 vcc gnd j1-3 rf agc
8 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . evaluation board layout board size 2.0? x 2.0? board thickness 0.032?, board material fr-4, multi-layer
9 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . lna + agc + mixer gain versus control voltage over temperature (freq = 100 mhz, v cc = 5.0 v) -5.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 0.51.01.52.02.53.03.54.04.5 rfagc (v) gain (db) -40c +25c +85c lna + agc + mixer + if amp - iip3 versus gain over temperature (freq = 100 mhz, v cc = 5.0 v) 70.0 72.0 74.0 76.0 78.0 80.0 82.0 84.0 86.0 88.0 90.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 gain (db) iip3 (db v) -40c +25c +85c ssb, cascaded noise figure versus gain over temperature (freq = 100 mhz, v cc = 5.0 v) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 25.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 gain (db) noise figure (db) -40c +25c +85c rf input vswr versus frequency across temperature (v cc = 5.0 v) 1.20 1.22 1.24 1.26 1.28 1.30 1.32 1.34 1.36 1.38 1.40 70.00 80.00 90.00 100.00 110.00 120.00 130.00 frequency (mhz) rf input vswr -40c +25c +85c lo input vswr versus temperature across temperature (v cc = 5.0 v) 1.50 1.55 1.60 1.65 1.70 1.75 118.00 128.00 138.00 148.00 158.00 168.00 178.00 frequency (mhz) lo input vswr -40c +25c +85c
10 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . 0 1.0 1.0 -1.0 10.0 1 0 . 0 - 1 0 . 0 5.0 5 . 0 - 5 . 0 2.0 2 . 0 - 2 . 0 3.0 3 . 0 - 3 . 0 4.0 4 . 0 - 4 . 0 0.2 0 . 2 - 0 . 2 0.4 0. 4 - 0 . 4 0.6 0 . 6 - 0 . 6 0.8 0 . 8 - 0 . 8 lo input, temp = +25c swp max 0.2ghz swp min 0.05ghz 0 1.0 1.0 -1.0 10.0 1 0 . 0 - 1 0 . 0 5.0 5 . 0 - 5 . 0 2.0 2 . 0 - 2 . 0 3.0 3 . 0 - 3 . 0 4.0 4 . 0 - 4 . 0 0.2 0 . 2 - 0 . 2 0.4 0 . 4 - 0 . 4 0.6 0 . 6 - 0 . 6 0.8 0 . 8 - 0 . 8 rf input, temp = +25c swp max 0.2ghz swp min 0.05ghz
11 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . pcb design requirements pcb surface finish the pcb surface finish used for rfmd?s qualification process is electroless nickel, immersion gold. typical thickness is 3 inch to 8 inch gold over 180 inch nickel. pcb land pattern recommendation pcb land patterns are based on ipc-sm-782 standards when po ssible. the pad pattern shown has been developed and tested for optimized assembly at rfmd; however, it may require so me modifications to address co mpany specific assembly pro- cesses. the pcb land pattern has been develope d to accommodate lead and package tolerances. pcb metal land pattern a = 0.69 x 0.28 (mm) typ. b = 0.28 x 0.69 (mm) typ. c = 2.40 (mm) sq. dimensions in mm. 1.95 typ. 0.65 typ. 0.65 typ. 0.81 typ. 0.81 typ. 0.98 0.98 1.95 typ. pin 1 pin 16 pin 12 pin 8 b b b b a a a a a c a a a b b b b figure 1. pcb metal land pattern (top view)
12 of 12 RF3334 rev a6 ds061016 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or sales-support@rfmd.com . pcb solder mask pattern liquid photo-imageable (lpi) so lder mask is recommended. the solder mask footprint will match what is shown for the pcb metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. the center-grounding pad shall also have a solder mask clearance. expansion of the pads to create solder mask clearance can be provided in the master data or reques ted from the pcb fabrication supplier. thermal pad and via design the pcb land pattern has been designed with a thermal pad th at matches the die paddle size on the bottom of the device. thermal vias are required in the pcb layout to effectively conduct heat away from the package. the via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. the via pattern used for the rfmd qualification is based on th ru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm pl ating on via walls. if micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. a = 0.79 x 0.38 (mm) typ. b = 0.38 x 0.79 (mm) typ. c = 2.50 (mm) sq. dimensions in mm. 1.95 typ. 0.65 typ. 0.65 typ. 0.81 typ. 0.81 typ. 0.98 1.95 typ. 0.98 b b b b a a a a b b b b a a a a c pin 1 pin 16 pin 12 pin 8 figure 2. pcb solder mask pattern (top view)

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